Career Center

The Department of Dermatology, in coordination with the Stem Cell Institute, is offering an exciting postdoctoral bioengineer position for a driven and motivated researcher to contribute to cutting-edge research in the development of a universal Organ-on-Chip (OoC) platform for tissue injury such as radiation and countermeasure discovery. This project aims to address the significant health risks associated tissue injury particular with exposure to ionizing radiation, whether intentional, accidental, or as part of cancer treatment.

Project Overview

Tissue injury and exposure to ionizing radiation poses a serious threat to human health, leading to acute radiation syndrome (ARS) and long-term radiation-induced sequelae affecting various organs. Despite the importance of finding medical countermeasures (MCMs) protect against radiation injuries, there is a notable lack of FDA-approved mitigators for various ARS subsyndromes or potential neurological, cardiac, and pulmonary radiation-induced effects.

This project will leverage recent advances in 3D printing and organ-on-chip (OoC) technologies to develop a universal OoC platform capable of accurately simulating human tissue responses to radiation exposure. By using human cells, this platform will provide better mimicry of the human biological response compared to traditional animal models.

The project will involve developing tissue models using human cells with high functional relevance for radiation exposure and a common platform for tissue constructs with first demonstration of selected organs such as skin.

Job Responsibilities

The selected candidate will undertake cell culture experiments encompassing a wide array of primary cells, cell lines, and cells derived from induced pluripotent stem cells (iPSCs). This role entails conducting both monolayer and 3D organotypic cell cultures. Integral to this role is the application of various techniques in molecular biology characterization, including but not limited to quantitative polymerase chain reaction (qPCR), western blot analysis, and immunohistochemistry. The candidate will collaborate closely with our engineering counterparts, collaborating on the implementation of 3D printed devices and microfluidic chips within experimental frameworks. Furthermore, active engagement in the enhancement and finalization of the current prototype will be a central aspect of this position.

The candidate's involvement extends to the progression of molecular biology projects within our laboratory, with a specific focus on leveraging epigenetic and transcriptomic analyses, in addition to employing molecular biochemical methodologies to understand regulatory mechanisms governing the interactions between epithelial, immune, and nervous system. Our laboratory predominantly harnesses primary keratinocytes, iPSC-derived epithelial cells and sensory neurons, as well as 2D and 3D model systems and human biopsies, as fundamental tools for our investigations. By joining our team, the chosen candidate will contribute substantively to cutting-edge research at the intersection of multiple disciplines, making significant strides in our understanding of cell interactions and molecular mechanisms.

Required Qualifications

• PhD in Biomedical Engineering, Cell Biology, Molecular Biology, or a related field.
• Strong expertise in 3D printing and organ-on-chip technologies.
• Experience in working with human cells and tissue engineering.
• Proficiency in molecular and cellular biology techniques, imaging, and data analysis.
• Ability to work independently and collaboratively in a multidisciplinary team.
• Excellent communication and organizational skills. Passionate about their work with strong work ethics.
• Authorized to work for any employer in the United States. The Department is unable to sponsor or take over sponsorship of employment Visas for this position.

Preferred Qualifications

• Familiarity with tissue injury and radiobiology, radiation exposure, and radiation-induced injuries.
• A track record of scientific publications in relevant fields.
• Knowledge of SolidWorks, COMSOL Multiphysics, and other related engineering software.

About University of Minnesota Twin Cities

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